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- Prototyping Boards & Accessories
Product Description

This SMD to DIP breakout board enables the easy conversion of a surface mount package to a DIP form factor. This adapter makes prototyping with surface mount parts fast and easy. Through-holes with a standard 0.1" pitch allow the board to work with common headers and enable SMD parts to be used in breadboards and perfboards. This board has an ENIG surface finish and is made of high quality FR4 which can withstand high temperature soldering and re-work. Besides the standard pins, this board also breaks out the bottom pad of a QFN part. This pad is connected to one through-hole on each side of the board labeled "PAD", it is also routed to a centered through-hole for quick access. The QFN bottom pad is connected through to the back side of the adapter to make soldering easier.
Mechanical Drawing

- Converts a QFN 24-Pin SMD part to a DIP form factor
- High quality PCB can withstand re-work
- Enables SMD parts to be used with a breadboard, perfboard, or protoboard
- 0.1" pitch holes for standard headers
Usage
This board is designed to fit breadboards, perfboards, and protoboards with a standard 0.1" spacing. The two rows of DIP holes are spaced 0.5 inches apart with 0.1 inches between the individual holes.
Footprint
This adapter works with 24-pin QFN SMD components. All 24-pins as well as the bottom pad are broken out for easy access while prototyping and debugging.

Electrical Connections
Each pin of the QFN part is electrically connected to one of the through-hole connections on the SMD to DIP adapter board. The bottom pad of the QFN part is also connected to one through hole on each side of the board.
Specifications
DIP Pitch | 0.1" |
SMD Package | QFN-24 |
SMD Size | 4mm x 4mm |
SMD Pitch | 0.5mm |
Surface Finish | ENIG |
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